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二次冷轧镀锡板的合金-锡电偶合研究 被引量:4

Studies on the alloy-tin couple for the double reduced tinplate
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摘要 采用电化学方法研究武钢研制的二次冷轧镀锡板合金-锡电偶合ATC值和合金锡量,并利用扫描电镜观察合金层的形貌。研究结果表明,武钢二次冷轧镀锡板ATC平均值≤0.12μA/cm2,合金锡量在0.9 g/m2以上,合金层形貌致密连续,ATC值达到国标GB/T 2520-2008和美国标准ASTM A623M-06a合金-锡电偶合指标要求。 The alloy-tin couple (ATC) value, the alloy-tin quantity and the morphology of the alloy layer of the double reduced tinplate produced in WISCO were studied using electro-chemical methods in conjunction with observation of scanning electron microscopy (SEM). The results showed that average ATC value of the double reduced tinplate was no more than 0. 12 μA/cm^2 , the alloy tin quantity was more than 0. 9 g/m^2, the morphology of the alloy layer was consistent and dense, and ATC value of the double reduced tinplate met the national standard GB/T 2520-2008 and the United States standard ASTM A 623M-06a.
出处 《武钢技术》 CAS 2009年第6期9-11,共3页 Wisco Technology
关键词 二次冷轧 镀锡板 合金-锡电偶合 double reduced tinplate alloy-tin couple
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