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还原方法对热浸涂银/卤化银参比电极的影响 被引量:3

Effect of Reduction Methods on Ag/AgX Reference Electrodes Prepared by Thermal Dip-coating Method
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摘要 分别使用热浸涂-氢还原与热浸涂-电化学还原方法制备了银/卤化银(Ag/AgX)参比电极。采用SEM观察、电化学阻抗测量、耐极化性能测试等方法研究了参比电极的微观结构和电化学性能,结果表明,不同还原方法对电极性能有明显影响。电化学还原法制备的电极较氢还原法所制备的电极内阻小,比表面积大,耐极化性能好。不同还原法所制备的电极的电位稳定性和温度系数没有明显区别。 Ag/AgX reference electrodes were prepared by thermal dip-coating with hydrogen reduction and electrochemical reduction method. The microstrueture and electrochemical performance were studied using SEM, EDX , EIS, and constant current polarization. The results show that the different reduction methods had obvious effect on the performance of the Ag/AgX electrodes. The electrode prepared by electrochemical reduction had smaller internal resistance, larger active surface area and better anti-polarization ability than the electrode by hydrogen reduction. But there was no obvious difference in the stability and temperature coefficient between the electrodes prepared by different reduction methods.
出处 《腐蚀与防护》 CAS 北大核心 2009年第10期697-700,共4页 Corrosion & Protection
关键词 参比电极 银/卤化银 还原方法 reference electrode Ag/AgX reduction method
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参考文献8

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