摘要
本工作通过研究含铅的银电极与无铅的银电极对负温度系数(NTC)热敏电阻电性能、结构的影响,探讨了含铅银电极中铅组分对NTC热敏电阻性能的影响机理。实验结果表明:含铅银电极的热敏电阻与无铅银电极的热敏电阻相比,在电性能上,阻值离散性较小,老化可靠性较好;在结构上,含铅的银电极与NTC陶瓷界面处扩散反应程度更大,银电极能够和NTC瓷体很好地结合。分析认为电极/陶瓷界面的结构质量是影响NTC热敏电阻阻值的离散性和老化可靠性的重要原因。在研究基础上,对NTC热敏电阻用高性能、无铅银电极浆料研制的工作方向进行了探讨。
The structures and electrical properties of NTC thermistors with Pb and without Pb in the Ag-electrodes were compared, through which the influences of Pb-containing additives in the Ag-electrodes on the electrical properties of NTC thermistors were studied. The results showed that the resistance scattering and aging reliability of NTC thermistors with Pb in the electrodes varied less than those of the thermistors without Pb in the electrodes. The diffusion at the interface of Pb-containing electrode/NTC ceramic was stronger and the bonding between the electrode and ceramic was better. According to the experimental results, it was suggested that the bonding quality between the electrode and NTC ceramic determines the resistance scattering and aging reliability of the NTC thermistors. Based on the study, the authors discussed the directions of developing high-performance and Pb-free Ag-electrode pastes for NTC thermistors.
出处
《金属世界》
2009年第C00期38-41,共4页
Metal World
基金
北京市科技新星计划资助项目(2007B025)
