摘要
本文分别采用Fick第二定律和Fourier热传导定律模拟了板条的湿气场和温度场,并利用分离变量法给出了板条湿气场和温度场的解析解;采用Wong模型的Kitano和Galloway形式,模拟了回流焊接过程中产生的蒸汽压力;基于Weitsman湿热粘弹性本构关系,利用半逆解法和Laplace变换法,给出了在蒸汽压力作用下湿热粘弹性板条位移场和应力场的解析解。借助解析解,研究了温度和湿度对蒸汽压力作用下粘弹性板条位移场和应力场时空分布的影响。
The moisture and temperature fields of a strip were simulated by Fick＇s second law and Fourier thermal conductivity law, respectively. The analytical solutions for temperature and moisture fields of the strip were given by the method of variables separation. The vapor pressure during reflow soldering processes was simulated by Kitano- and Galloway-type formulations of Wong model. Based on the hygro- thermal viscoelastic constitutive relation presented by Weitsman, the analytical solutions for the displacement and stress fields of the hygrothermal viscoelastic strip under vapor pressure loads were presented by semi-inverse method and Laplace transform method. By means of the analytical solution, the effects of temperature and moisture on temporal spatial distributions of displacement and stress fields of the strip were investigated.
出处
《力学季刊》
CSCD
北大核心
2009年第3期393-397,共5页
Chinese Quarterly of Mechanics
基金
国家自然科学基金(0872121)
上海市自然科学基金(07ZR14037)
国家自然科学基金重大项目(90816001)
国家杰出青年基金(10725209)
上海市重点学科建设项目(530106)
关键词
板条
粘弹性
湿气场
温度场
蒸汽压力
strip
viscoelasticity
moisture field
temperature field
vapor pressure
