摘要
综述了功率型白光LED封装的研究现状和存在的问题,着重从LED封装结构和封装材料两个方面进行了详细的评述。在现有蓝光芯片激发钇铝石榴石(YAG)荧光粉来实现节能、高效的白光LED照明的基础上,介绍了可以提高功率型白光LED的取光效率和空间色度的均匀性的各种封装结构和材料。指出新的封装结构、封装材料和封装工艺的有机结合以获得高取光效率,延长功率型白光LED的使用寿命,节约整体封装结构的成本,从而推进LED固体光源的应用是今后功率型白光LED研究的重点。
The status and problems of high-power white LED are reviewed and the structures and materials of packaging are discussed in detail. Base on the YAG phosphor excitated by the blue chip, the new structures and materials of packaging to extract more light and realize the uniformity of chromaticity are introduced. It is pointed out that the appropriate combination of the innovative structures, the materials, and the technologies of packaging is the development focus point of the high-power white LED in future.
出处
《激光与光电子学进展》
CSCD
北大核心
2009年第9期35-39,共5页
Laser & Optoelectronics Progress
基金
上海市科学技术委员会(07DZ22026
08ZR1415400和08DZ2272800)资助项目
关键词
大功率白光LED
荧光粉
灌封胶
封装材料
封装结构
high-power white LED phosphor pouring sealant package material
package structure
