摘要
采用粉末冶金方法，制备了用于电力电子半导体支撑板的一种新型的ＦｅＮｉ／Ｃｕ复合材料（简称ＤＧ合金），详细研究了ＤＧ合金，电阻性能的各种影响因素———铜含量、烧结温度、ＦｅＮｉ粉和铜粉的粒度、Ｃｕ纤维的长径比。实验结果表明：ＤＧ合金的电阻率不仅与铜含量有关，还与ＦｅＮｉ与Ｃｕ相的界面扩散、分布形态、结合强度有关。
DG alloy, which is a new kind of composites composed of FeNi and Cu and used for power semiconductor support materials, was made by powder metallurgy. Many factors affecting DG alloy electrical resistivity including Cu content, sintering temperature, the pratical size of FeNi powder and Cu powder, the ratio of length to radius of Cu fiber, were studied. The experimental results showed that the change of electrical resistivity of DG composites is mainly relevent to the distribution and the diffusion of FeNi phase and Cu phase as well as Cu content.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
1998年第3期395-398,共4页
The Chinese Journal of Nonferrous Metals
关键词
DG合金
复合材料
电阻性能
扩散
DG alloy composites electrical property diffusion
