摘要
防渗镀铜层主要用于热处理过程中的防渗氮、渗碳及氰化。阐述了防渗镀铜层的质量要求，分析了电镀铜过程中可能产生的故障及解决方法。
Anti-permeation copper electrodeposits have for mostly used for anti- carburization, anti-nitridation, and anti-cyanidation in thermal treatment. In order to reach satisfied antipermeation results, copper electrodeposits must be of good coherence, less porosity and with uniform fine crystal grains. Defective dposits and the trouble-shooting methods were described.
出处
《电镀与涂饰》
CAS
CSCD
1998年第3期55-57,共3页
Electroplating & Finishing
关键词
防渗
电镀
渗碳
渗氮
氰化
镀铜
anti-permeation, copper electrodeposition, carburization, nitridation, cyaniding
