摘要
针对单搭接接头,根据胶粘剂固化过程中的传热情况,将其温度场简化为无内热源的热传导问题,将平均换热系数看作固化温度的函数,采用集总参数法,得到胶粘剂固化过程中温度的预测公式,并用实验对公式计算结果进行了验证。运用该公式,分别讨论了固化温度、固化时间、被粘物材料属性、被粘物厚度、搭接长度、被粘物长度、胶粘剂初始温度、搭接宽度对胶粘剂固化过程中的温度影响规律。结果表明,前面5个因素对胶粘剂固化过程中的温度影响较大,后面两个因素基本无影响,当搭接长度相同,且与被粘物长度比值小于0.3时,被粘物长度也基本无影响。
According to the heat transfer in curing process, the temperature field of the adhesive in a single - lapped joint is simplified without inner heat source. The heat transfer coefficient is a function of curing temperature. The prediction formula was obtained by using of lumped parameters method. The temperature of the adhesive at any time was calculated and validated by the experiments. The influence law of all factors were discussed which include curing temperature, curing time, properties of adherends, thickness of adherends, lap length, length of adherends, initial temperature of the adhesive, lap width. The results showed that the first five factors had great influence on the temperature of adhesive in curing process, while the last two factors had little influence. The length of adherends also has little influence when the lap length is the same and the ratio between them is less than 0.3.
出处
《应用化工》
CAS
CSCD
2009年第8期1167-1170,1173,共5页
Applied Chemical Industry
关键词
单搭接接头
集总参数法
预测
影响规律
single-lapped joints
lumped parameters method
prediction
influence law
