摘要
采用随机中点位移法通过计算机模拟抛光垫和晶片的基于分形的粗糙表面,构造了一种新的膜厚方程。在新膜厚方程的基础上分析了一般润滑方程及带离心项的润滑方程对化学机械抛光(CMP)过程中抛光液的压力分布以及无量纲载荷和转矩的影响。结果表明,考虑抛光垫和晶片表面的粗糙程度的影响时,抛光液的压力分布有一定的波动,且压力最大值有所增大,压力最小值有所减小;此外无量纲载荷和转矩的数值也变小。
The rough surface was simulated based on the fractal of pad and wafer by using random midpoint displacement method via computer, and a modified film thickness equation was presented. Based on the modified film thickness, the effect of surface roughness on pressure distribution, dimensionless load and torque in the course of the chemical mechanical polishing （CMP） was analyzed by the general lubrication equation and the modified lubrication equation with centrifugal force. The results show that when considering the effect of the surface roughness of polished pad and wafer, the fluid pressure distribution has some fluctuation, the maximum pressure value is increased, the minimum pressure value is decreased, and the dimensionless load and torque are decreased.
出处
《润滑与密封》
CAS
CSCD
北大核心
2009年第8期33-38,52,共7页
Lubrication Engineering
基金
国家自然科学基金项目(50675185)
教育部新世纪人才项目(NCET06-0708)
关键词
化学机械抛光
润滑方程
粗糙表面
分形
chemical mechanical polishing
lubrication equation
rough surfaces
fractal
