摘要
研究了In焊料的电镀制备方法和制备过程,分析了In焊料电镀过程中出现的镀层覆盖不完全、焊料晶粒尺度大、焊料熔化后气孔较多、凝固后表面不均匀等问题的起因,并针对这些问题,作了相应的实验改进。通过调整镀液的pH值,优化电镀电流、添加光亮剂等方法,深入讨论并得到了直流、脉冲两种电镀方式下的电镀条件,实现了稳定可控的镀速和相对较小的焊料晶粒,在半导体激光器工业的焊料制备方面具有实践意义。
The In electroplating techniques and fabrication process were summarized. Some serious phenomena such as the coverage ability, electroplating grain size, the gas separating out being melted and the flatness after solidification were investigated. With the related issues of In electroplating, many concerns including the bath pH value, current form and density, bath organic chemicals were analyzed. The final proper plating conditions, capability of controlling the depositing thickness and the relative small size of the deposition grains were obtained. It reveals that this method is of good feasibility in the diode package industry.
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第8期763-766,共4页
Semiconductor Technology
基金
国家863项目(2008AA000506)
