摘要
电子工业的不断发展促进了电子器件的微小型化,作为新型产品设计基础的微电子器件可靠性分析成为人们非常关注的问题.力学参数的测量可以为可靠性评价提供有价值的实验依据.概括总结了显微云纹技术的发展,主要介绍了云纹干涉法和扫描显微镜云纹方法及其在微电子器件全场变形场测量中的应用.
The micro-miniature of electronic devices is greatly promoted by the rapid development of electronics industry. The study on the reliability of the micro-electronic devices is the foundation of designing novel electronic products, and has drawn much attention of researchers. The parameters of mechanical behavior obtained from experiment are the basis of reliability analysis. In this study, the development of micro-moire methods is reviewed, covering moire interferometry, scanning electronic microscope moire methods and their applications to analysis of mechanical behavior of the micro-electronic devices are discussed.
出处
《力学与实践》
CSCD
北大核心
2009年第3期1-8,共8页
Mechanics in Engineering
基金
国家重点基础研究发展计划(973计划)(2004CB619304
2007CB936803)
国家自然科学基金资助项目(10625209
10732080
10472050)
教育部新世纪优秀人才支持计划((KFJJ03-1)
北京市自然科学基金资助项目(3072007)
关键词
显微云纹
微电子器件
变形分析
micro-moire, micro-electronic devices, deformation analysis
