摘要
三维片上网络是集成电路领域的新技术,用于解决目前片上系统集成度越来越高所面临的通信瓶颈。本文介绍了当前三维片上网络的拓扑和相关技术,提出了三种新型的基于DeBruijn图的拓扑,并对各种拓扑的性能参数进行了比较。
The three-dimensional network on chip is a new technology in VLSI, in order to solve the communication challenges of system on chip caused by high integration. The state of the art topologies and relative techniques for 3D NoC are introduced in this area, three novel 3D topologies based on De Bruijn graph are proposed, and the performance parameters of these topologies are compared.
出处
《电信科学》
北大核心
2009年第4期39-44,共6页
Telecommunications Science
基金
国家"863"计划基金资助项目(No.2007AA01Z291)
自然科学基金资助项目(No.60873076)
关键词
片上网络
三维封装
拓扑
network on chip, 3D package, topologic architecture
