摘要
介绍了用真空感应熔炼方法生产用于高阻值薄膜电阻器的磁控溅射靶材，并报告了用这种靶材进行薄膜电阻器生产的溅射工艺参数和热处理方法，以及电阻器的电学性能测试结果。实际生产表明，这种用真空感应熔炼方法生产的靶材，完全能用于薄膜电阻器的磁控溅射并能得到满意的薄膜电阻器的性能指标。
This paper dealt with the manufacturing of sputtering targets by vacuum induction melt metallurgical method. The target was used for the magnetic sputtering deposition of thin film resistors with high resistivity and low TCR (Temperature Coefficient of Resistance). The sputtering process and post annealing as well as the properties for the resistors were addressed. The results showed the applicable of the target for electronics.
出处
《功能材料》
EI
CAS
CSCD
北大核心
1998年第3期260-263,共4页
Journal of Functional Materials
基金
国家自然科学基金
关键词
电阻器
真空感应熔炼
靶材
磁控
薄膜电阻器
vacuum induction melt metallurgy, target, sputtering deposition, thin film resistors
