摘要
废弃线路板的粉碎和所含金属组分的高效解离是后续分选回收的前提条件。本研究分别使用乙二胺等10种溶剂浸泡废弃线路板,比较对线路板中铜箔与基板间剥离强度的影响,从而筛选出4种有代表性的溶剂,即溶剂D、溶剂F、丙酮和水,比较废弃线路板经化学溶胀后的单体解离度和获得一定粒径分布的颗粒所需的破碎时间。研究结果表明,化学溶胀后破碎能大幅提高金属的单体解离度,浸泡效果的优良排序为:溶剂D>溶剂F>丙酮>水;浸泡时间越长,浸泡温度越高,对剥离强度的降低越有利;使用溶剂D在150℃、3 h或140℃、5 h的工艺下浸泡废弃线路板,可以使铜箔与基板自动脱落。研究结果为后续的分选提供了便利的条件。
Comminuting of discarded printed circuit boards （PCBs） and high effective seperation of the metal composition from nonmetals is the prerequisite for the following sequence separation process. In this paper, PCBs are immersed in ethylenediamine or other nine kinds of solvents in order to compare the effect of swellings of chemicals on peel strength and pick out four typical solvents, which are respectively solvent D, solvent F, acetone, and water. -The monomer dissociation degree and the essential comminuting time aiming to get the certain size particles were investigated after immersion using these four solvents respectively. Experimental results show that swellings of chemicals could enhance monomer dissociation degree of the metal composition, and the effect in turn is solvent D, solvent F, acetone, and water. The longer the time and the higher the temperature, it is more beneficial to decrease steel strength. Under the conditions of 150 ℃ ,3 h or 140 ℃ ,5 h using solvent D to dip PCBs, the copper will fall off from the boards spontaneously, which is favorable to increasing the separation efficiency in the following separation processing.
出处
《环境工程学报》
CAS
CSCD
北大核心
2009年第1期183-188,共6页
Chinese Journal of Environmental Engineering
基金
中国科学院知识创新重要方向性项目(KZCX2-YW-412)
关键词
废弃线路板
剥离强度
单体解离度
discarded printed circuit boards
peel strength
monomer dissociation degree
