摘要
当今电子产品的功能不断增加,随之而来的是对电子产品设计多样化的要求。正是由于这种需求,刚挠结合板以其巨大的技术进步和不断增加的需求而获得关注。这其中的不流动性半固化片是将刚性板与挠性板结合在一起的关键材料,它的主要功能是在刚性材料和挠性材料之间形成可靠性的粘接层,所以对该材料界面性质和功能进行研究。对于不流动性半固化片的应用来说是至关重要的。现在,一种新的基于酚醛固化树脂体系的不流动性半固化片已经被开发出来,这种新型材料显示了优异的耐热性和可靠性。经过热性能分析和热冲击测试,这种新型材料的性能比传统的DICY固化环氧树脂体系材料更加优越。
An increasing functions are added to electronic products,the versatility for product design is required.Due to this reason,rigid-flex PCB has drawn attention for its significant progress and increasing demand.The key material to combine both rigid and flexible PCBs together is no flow prepreg.The main function for this material is to produce a reliable bonding layer between rigid and flexible materials.Therefore,study of material interface properties and behaviors is of crucial importance for no flow prepreg applications.A new no flow prepreg based on a phenolic-cured system has been developed.The newly developed material showed excellent heat resistance and reliability.The properties are superior to those of conventional dicy-cured system as characterized by thermal analyses and thermal shock tests.
出处
《印制电路信息》
2009年第1期32-34,共3页
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