期刊文献+

封套的光热环境与表面热流影响因素分析 被引量:1

Light thermal environment and surface heat current analysis of envelope
下载PDF
导出
摘要 从封套所处的光热环境出发,介绍了封套与环境之间几种典型的热量交换形式,包括:太阳辐射、大气逆辐射、地面的热反射与热辐射,以及封套表面的对流换热等。在合理假设的基础上,构建了封套传热的数学模型,分析了几种主要因素对封套表面热流密度的影响。研究结果对弹药等的野外储存具有一定的指导意义。 Several kinds of heat exchange between envelope and environment were introduced, such as sun radiation, air athwart radiation, heat echo and radiation of ground and heat convection on envelope surface. Based on some proper assumptions, the mathematic model of heat-transmit was constructed, and the equations of heat current density on envelope surface were established. The effect of several kinds of factors on heat current was analysed. The result had some instructional meaning to the field storage of ammunition.
作者 易建政 梁波
出处 《河北工业科技》 CAS 2008年第6期346-348,351,共4页 Hebei Journal of Industrial Science and Technology
关键词 封套 光热环境 热流密度 数学模型 envelope light thermal environment heat current density mathematic model
  • 相关文献

参考文献3

二级参考文献5

共引文献12

同被引文献10

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部