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ALLOYING EFFECT OF Ni AND Cr ON THE WETTABILITY OF COPPER ON W SUBSTRATE 被引量:5

ALLOYING EFFECT OF Ni AND Cr ON THE WETTABILITY OF COPPER ON W SUBSTRATE
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摘要 By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and the wetting mechanisms of copper on W substrate have been investigated in detail. The results show that the wetting angles of Cu on the W substrate are decreased with an increase in the content of Ni or Cr, and also decrease with raising the wetting temperatures. SEM, EPMA, and X-ray diffraction have been used to analyze the interracial characteristics of the CuNi/W and CuCr/W systems. The results reveal that there is a transition layer about 2- 3μm in the interface of Cu-4.0 wt pct Ni/W, in which the interrnetallic phase Ni4W is precipitated. As to CuCr/W system, no reaction occurs at the interface. The two factors are that the contents of Cr and Ni and the infiltration temperature must be chosen appropriately in order to control the interfacial dissolution and reaction when the Cu- W alloys are prepared by the infiltration method. By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and the wetting mechanisms of copper on W substrate have been investigated in detail. The results show that the wetting angles of Cu on the W substrate are decreased with an increase in the content of Ni or Cr, and also decrease with raising the wetting temperatures. SEM, EPMA, and X-ray diffraction have been used to analyze the interracial characteristics of the CuNi/W and CuCr/W systems. The results reveal that there is a transition layer about 2- 3μm in the interface of Cu-4.0 wt pct Ni/W, in which the interrnetallic phase Ni4W is precipitated. As to CuCr/W system, no reaction occurs at the interface. The two factors are that the contents of Cr and Ni and the infiltration temperature must be chosen appropriately in order to control the interfacial dissolution and reaction when the Cu- W alloys are prepared by the infiltration method.
出处 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2008年第5期369-379,共11页 金属学报(英文版)
基金 the National Natural Science Foundation of China(No.50474012) Program for New Century Excellent Talents in University (GrantNo.NCET-05-0873).
关键词 WETTABILITY Contact angles Cu Cr Ni W substrate Wettability Contact angles Cu, Cr, Ni W substrate
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