摘要
随着电子技术的迅速发展,电子元器件的总功率密度大幅度增长而物理尺寸却越来越小,而且高温的温度环境会影响电子元器件的性能。有效解决电子元器件的散热问题已成为当前电子元器件和电子设备制造的关键技术,液体冷却技术可在一定程度上适应高热流密度的散热要求。针对模块上电子元器件的液冷问题,该文综述液体冷却的特点,设计不同通道形式的冷板,并进行适当的应用分析。
With the rapid development of electronic technology, their power density are significantly increased, and their physical dimension are smaller, which lead to higher temperature environment affecting the performance of themselves. More effective heat control is required. Therefore, it is the key technique in the packing and fabricating process that effectively solving the problem of heat dissipation in electronic components. The paper sums up the character of liquid cooling, designs the cold plates with different channel, also makes the actual application and analysis.
出处
《计算机工程》
CAS
CSCD
北大核心
2008年第B09期172-174,共3页
Computer Engineering
关键词
液冷
冷板
电子器件
仿真
liquid cooling
cold plate
electronic components
imitation
