摘要
芯片尺寸封装技术是90年代初出现的一种新型封装技术,是封装领域的重要发展方向。
Chip Size Package (CSP) which appeared at the early 1990′s is a new packaging technologyIt is becoming a developing trend in IC packagingVarious CSP technologies are describedTheir structures and characteristics are dealt with
出处
《微电子学》
CAS
CSCD
北大核心
1997年第6期403-407,共5页
Microelectronics