摘要
采用有限元法分析FCBGA(flip chip ball grid array)器件焊点可靠性,采用统一型粘塑性Anand本构方程研究了Sn63Pb37合金的力学行为。结果表明,应力集中区域为器件芯片边缘拐角焊点的上表面。应力时间历程处理发现:应力随时间呈周期性变化,曲线有明显的应力松弛现象和累积迭加的趋势。对三种不同球状焊点尺寸器件的研究结果发现,球状焊点尺寸为0.4mm×0.28mm时,焊点应力最大,0.46mm×0.34mm焊点次之,0.52mm×0.4mm焊点应力最小。基于塑性应变能分析的结果亦与上述变化趋势相同,且与实际应用器件的试验数据变化趋势一致。
Finite element method is used to analysis the soldered joint reliability of FCBGA, the unified viscoplastic Anand constitutive equation is employed to represent the viscoplastic deformation behavior of Sn63Pb37 alloy. The results shows that the stress concentrated on the top surface of the chip-edge FCBGA corner soldered joint and present cyclical changes with time, stress relaxation and accumulated enhancement trend of stress can be obvious acquired from the curve. Select three different ball size device for the study, it indicates that the ball size of 0.4 mm × 0.28mm has the maximal soldered joint stress,0.46 mm × 0.34mm ball second,and 0.52 mm × 0.4mm ball minimum. Based on the analysis of plastic work accumulation can acquire the same trend. The trends is obtained by the consistent results with practical application of the device. At the same time provide a basis for the theoretical research of flip-chip devices.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2008年第8期73-76,共4页
Transactions of The China Welding Institution
基金
2006年江苏省"六大人才高峰"基金资助项目(06-E-020)
江苏省普通高校研究生科技创新计划基金资助项目(CX07B-087z)
关键词
FCBGA
有限元法
粘塑性
应力集中
FCBGA
finite element method
viscoplastic
stress concentration
