摘要
利用快速凝固技术制备出Cu-Ni-Sn-P非晶箔带钎料.将此钎料分别在不同钎焊温度和钎焊时间下与紫铜进行真空钎焊,借助EPMA分析了钎缝的显微组织结构.利用DTA分析了成分相同的非晶钎料与普通钎料的润湿性差异.结果表明:与普通钎料相比,非晶钎料的润湿性明显提高,钎料与母材的相互扩散和冶金结合增强.
Cu-Ni-Sn-P brazing ribbons were prepared by means of rapid solidification technique. The microstructures and wettabilities of brazed joints brazed at different brazing temperatures and holding times were analyzed by using DTA and EPMA measurements. The results showed that the wettability of the brazing foils was significantly improved. The interdiffusion between the base metal and filler metals was enhanced, leading to the metallurgical bonding.
出处
《材料研究与应用》
CAS
2008年第2期119-122,共4页
Materials Research and Application
