摘要
Al丝超声键合技术是混合电路组装中使用得最为普遍的一种键合技术。本文使用焊点破坏性拉力试验和焊点的接触电阻测试两种方法，研究了导体材料（Au、Pd—Au）、膜层厚度、125℃、300℃热老练和温度循环对焊点键合强度的影响。分析了键合强度降低和焊点失效的原因。
Ultrasonic aluminum wire bonding technogy is most widely applicated in hybrid ID. This paper studied the influence of the different conductor material such as AU|Pd-Au, the different film thickness.125℃. 300℃ thermal aging and temperature cycle on bond strength with two methods of destructive wire bond pull test and bond contact resistance test. The reason of the loss of bond strengthand eventual bond failure was discussed. Finally, several guides were presented based on the ultrasonic aluminum wire bonding metalligation systems considered in this paper.
出处
《微电子学与计算机》
CSCD
北大核心
1997年第6期1-5,共5页
Microelectronics & Computer
