摘要
探讨了固溶、时效热处理工艺对一种新型铜基电接触材料微观组织与结构的影响。结果表明,合金在固溶过程中形成Cu-Ni单相固溶体,在时效过程中产生Ni3Ti合金相,从而导致合金显微组织与结构的变化,提高材料的综合性能,获得一种高强、高导的电接触材料,满足实际生产的需求。
The effects of solution treatment and aging treatment on the microstructure of Cu-matrix electrical contact material were discussed. The results show that Cu-Ni solid is formed in the solution treatment process and alloy phase （Ni3Ti） is formed in the aging process, which induces the changes of microstructure and the improvement of the overall properties. The electrical contact material with high strength and high conductivity is obtained, which meet the needs of practical processing.
出处
《热加工工艺》
CSCD
北大核心
2008年第10期56-58,共3页
Hot Working Technology
基金
贵州贵阳市工业项目(2006-16-1)
关键词
铜基电接触材料
微观结构
固溶处理
时效处理
高导电性
Cu-matrix electrical contact material
microstructure
solution treatment
ageing treatment
high conductivity
