摘要
使用虚拟样机技术分析了集成电控模块的热弹耦合振动问题.给出了集成电控模块的热弹耦合数学模型,阐述了用虚拟样机技术设计集成电控模块的全过程.重点阐述了该设计过程中的结构场、温度场建模与验证方法,并对热弹耦合振动问题进行协同求解,给出了继电器工作点的分析结果.仿真结果表明,温度的升高使得继电器的加速度响应曲线整体上移,增幅最大达到30%左右.
Virtual prototyping （VP） is proposed to solve thermoelastic vibration of integrated electricity controlled module （IECM）. Mathematical model of IECM is given firstly; whole design process of IECM by VP is described then. Modeling and verification of structure filed and thermal field of this process is elaborated, and collaborative design was adopted to solve the thermoelastic vibration. Finally the results are given. It is found that the accelerate response curves shift upward along with temperature＇s growth. The maximum growth of accelerate response can reach 30%.
出处
《华中科技大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2008年第5期71-73,共3页
Journal of Huazhong University of Science and Technology(Natural Science Edition)
关键词
集成电控模块
虚拟样机技术
热弹耦合振动
协同仿真
integrated electricity controlled module
virtual prototyping technique
thermoelastic vibration
collaborative simulation
