摘要
无铅化电子组装中,由于原材料的变化带来了一系列工艺的变化,随之产生许多新的焊接缺陷。针对"黑盘"现象进行了产生机理分析,并给出了相应的解决措施。
Changes of material bring a series of process problems in lead - free electronic assembly with occurrence of new solder defects. Analyzes causes and give solution of solder defects for black pad in lead -free electronic assembly.
出处
《电子工艺技术》
2008年第3期180-183,共4页
Electronics Process Technology
关键词
无铅
焊点
缺陷
黑盘
Lead - tree
Solder Joint
Detect
Black Pad
