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半导体激光治疗腹部手术愈合不良伤口的疗效 被引量:2

Semiconductor Laser in Treatment of Unhealing Wound after Abdominal Operation
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摘要 目的探讨半导体激光治疗腹部手术愈合不良伤口的疗效。方法采用半导体激光治疗机对54例腹部手术患者不同程度愈合不良伤口进行治疗,激光波长810nm,功率280~400mW,光斑直径5.0cm,距离5~8cm,时间8min。结果照射的平均次数轻度愈合不良为(8.0±2.8);中度愈合不良为(8.9±1.9);重度愈合不良为18,疗效与激光照射次数差异无显著意义(P〉0.05)。半导体激光对轻度愈合不良伤口的疗效较中重度愈合不良的好,但差异无显著意义(P〉0.05)。结论轻度愈合不良的腹部伤口半导体激光的疗效较中、重度愈合不良的疗效好,如在伤口愈合不良早、中期选择半导体激光治疗可能获得良好的疗效。 Objective To evaluate the effect of semiconductor laser in unhealing wound after abdominal operation. Methods Fifty four cases of unhealing wound after abdominal operation were treated by semiconductor laser with a wavelength of 810 nm,power of 280-400 nm,spot size of 5.0 era,distance of 5-8 cm,and time of 8 min. Results The mildly unhealing case~ were treated for (8.0 +2. 8) times,the moderately unhealing cases for (8.9 ~ 1.9) times, both were less than that of severe unhealing, 18 times ( P 〈0.05 ). Effect of semiconductor laser in treatment of mildly unhealing wotind af- ter abdominal operation was better than that of moderately and severe unheabng, however, no significant difference was found (P 〉 0. 05). Conclusions Effect of semiconductor laser in treatment of mildly unhealing wound after abdominal operation is better than that of moderately and severe unhealing. Early treatment with semiconductor laser in unhealing wound may achieve better effect clinically.
出处 《中国激光医学杂志》 CAS CSCD 2007年第5期305-308,共4页 Chinese Journal of Laser Medicine & Surgery
关键词 激光 腹部 伤口 愈合 Laser Abdomen Wounds Healing
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