摘要
提出了一个新型电流叠加型的温度补偿电流源的设计，通过新增加一条电流支路，对温度特性进行优化，使用简单的结构，达到了很好的温度特性和电源电压调整率。使用XFAB公司的0．6μm CMOS工艺模型，Cadence模拟验证结果表明，在-40～135℃范围内，温度系数为16ppm／℃；电源电压抑制比为77．2dB。该方案已经应用于AC／DC转换器芯片。
A CMOS temperature-independent current reference with novel superposition structure is presented, which uses a third branch current to optimize the temperature features by curvature compensation. Developed for an AC/DC converter, the current reference is implemented in 0.6μm CMOS technology, which is simulated temperature coefficient of 16 ppm/℃ in the temperature range from - 40℃ to 135℃ and 77.2dB of simulated power supply rejection ratio （PSRR）.
出处
《微电子学与计算机》
CSCD
北大核心
2008年第3期114-118,共5页
Microelectronics & Computer
关键词
叠加型
温度补偿
温度系数
superposition
temperature compensation
temperature coefficient
