摘要
主要讨论了微型元器件诸如0201,01005以下元件,CSP器件等在电子产品组装过程中的焊膏印刷工艺。突出模板的厚度设计、开口外形设计、开口尺寸设计、材料选择以及PCB焊盘设计对微型元器件的要求;通过试验分析出哪种焊膏更适合微型元器件的焊膏印刷;试验证明出微型元器件需要寻求什么样的焊膏印刷工艺过程;总结出电子产品组装过程中运用微型元器件进行焊膏印刷的实际经验。
This paper mainly discusses the solder paste printing process of the micro-components such as 0201, 01005 components and CSP devices in the mounting of electronic products. Lay stress on the requirements of micro-components by the thickness design of stencH, the contour design of stench window, the size design of stench window, the material selection of stench and design of PCB pads analyzed out that kind of solder paste is more suitable to the solder paste printing process of the micro-components by the experiment. The test has demonstrated what kind of the solder paste printing process is more suitable for micro-components, summed up the practical experience of the using micro-components for the solder paste printing process in the process of assembling elec tronic products
出处
《丝网印刷》
2008年第2期8-11,共4页
Screen Printing
