摘要
测试了E-51环氧/TA-70固化体系从0℃至180℃在不同升温速率下的DSC曲线,通过Ozawa方程、Kissinger方程计算该体系的活化能,利用Crane方程计算该体系的反应级数。结果表明,DSC曲线呈单峰,通过2种方程计算的活化能相近,为57.05 kJ/mol,反应级数为0.92,接近1级反应。通过凝胶化时间及力学性能、粘接性能测试得出E-51/TA-70体系是室温固化体系,具有高韧性、高强度的力学性能。
The kinetics of the curing reaction of an epoxy network system E-51/TA-70 was studied by differential scanning calorimetry（ DSC ）. The dynamic DSC measurements were conducted using different heating rates at the temperature from 0 ℃ to 180 ℃. The apparent activation energy for the system was calculated using Kissinger and Ozawa methods. The order of reaction was computed by using Crane method. The DSC curves have one peak. The activation energies obtained from DSC using Ozawa and Kissinger methods are similar, and it is 57.05 kJ/mol. The value of reaction order is 0.92 , near first order reaction. The tesuhs of gelation times, mechanical properties and bond strength showed that the system E-51/TA-70 is a room temperature curing system with high toughness and high strength.
出处
《粘接》
CAS
2008年第2期22-24,32,共4页
Adhesion
