摘要
合成了9,9’-二[4-(2,3环氧丙氧基)苯基]芴,并以4,4’-二氨基二苯砜胺为固化剂,用非等温DSC法研究了其固化动力学,用Flynn-Wall-Ozawa法和Friedman法确定了固化动力学参数,用动力学模拟推测了固化机理函数,并用TGA法对等温固化树脂的耐热性进行了表征。结果表明:双酚芴环氧固化反应的表观活化能约63.86 kJ/mol,扩散因子为3.80×104s-1,反应级数为1.57;固化反应为枝状成核的自催化反应;等温固化后的环氧树脂于400℃开始分解,700℃时残碳率为41.73%。
A kind of highly thermal-resistant epoxy resin 9,9＇-bis [4-（2,3-epoxyproxy）phenyl] fluorene was synthesized. The curing kinetics was investigated using 4,4＇-diaminodiphenyl sulfone （DDS） as curing agent with a non-isothermal differential scanning calorimeter（DSC）. The most optimum curing kinetic parameters were calculated using Flynn-Wall-Ozawa and Friedman methods, the curing mechanism function was proposed using curing kinetics simulation. The thermal resistant property was characterized by thermal gravity analysis（TGA）. The results show： the apparent acti- vation energy, diffusion factor and reaction order of curing reaction are founded to be 63.86 kJ/mol, 3.80 × 10^4 s^-1 and 1. 57. The curing mechanism is auto-catalyze reaction forming branch-like reaction center. The isothermal curing epoxy resin begin to decompose at 400 ℃ ,the char yield is about to be 41.7% at 700 ℃.
出处
《功能高分子学报》
CAS
CSCD
北大核心
2007年第4期358-363,共6页
Journal of Functional Polymers
基金
国家高技术研究发展项目(863计划)(2003AA333020
2002AA333070)
关键词
非等温固化
固化动力学
芴型环氧
non-isothermal curing
curing mechanism
epoxy resin containing fluorene
