摘要
针对单晶Cu键合丝制备过程中的影响因素进行了系统分析,通过研究单晶Cu键合丝制备过程中坯料、模具、润滑、清洗及其制备和热处理过程中张力对单晶Cu键合丝性能和表面质量的影响,得出良好的坯料组织性能,模具定径区的高度光洁和圆整,有效的润滑和清洗及制备过程中精确的张力控制,是获得良好单晶Cu键合丝的关键。
The effect factor for preparation process of single crystal copper bonding wire were systematic analyzed, and the ingot, mould, lubrication, cleaning and tension in preparation and heat treatment were investigated, and found that the key factors of get the excellent single crystal copper bonding wire were the excellent microstructure propriety of ingot, the shape and smoothness of calibrating strap, effective lubrication and cleaning and precision tension controlling.
出处
《铸造技术》
CAS
北大核心
2007年第12期1648-1651,共4页
Foundry Technology
基金
甘肃省科技攻关项目(2GS064-A52-036-05)
关键词
单晶Cu键合丝
坯料
模具
润滑
张力
Single crystal copper bonding wire
Ingot
Mould
Lubrication
Tension
