摘要
概述了电解铜箔"U-WZ箔"和"DFF箔"的开发和特性,它们适用于COF用途等挠性覆铜板的铜箔。
This paper describes the development and characteristics of the electrolytic copper foil ＂V-W2 foil＂and ＂DFF＂, They are suitable to copper foil of flexible clad-copper laminate for COF etc, application,
出处
《印制电路信息》
2007年第12期42-47,54,共7页
Printed Circuit Information
关键词
挠性覆铜板
电解铜箔
COF
flexible clad-copper laminate
electrolytic copper foil
COF
