摘要
试验研究了Sn-9Zn合金钎料在温度为40～100℃和压力为9.3～18.6MPa范围内的压蠕变行为。结果表明:随温度和应力的升高,合金的压蠕变量增大,稳态蠕变速率的对数分别与应力对数和温度呈较好的线性关系,稳态蠕变速率符合半经验公式。在不同的温度下,应力指数n相近,平均值为5.74;不同的应力下,表观激活能Qa相差不大,平均值为51.95kJ/mol,材料结构常数为0.03,压蠕变变形是位错滑移和位错攀移共同作用的结果,控制稳态蠕变速率的主要因素为位错管道扩散过程控制下的位错攀移。
The compressive creep behavior of Sn-9Zn alloy was investigated at temperature in the rang of 40-100 ℃ and different compressive stresses between 9.3 MPa-18.6 MPa. The results show that the creep increases with increasing temperature and compressive stress. There is a linear logarithmic relationship between the steady creep rate and the temperature and stress. The steady creep rate is in accordance with an empirical equation. The stress exponents are similar at different temperatures and the appearance activation energies has slight difference under different stresses. The average values are 5.74 and 51.95 kJ/mol respectively. Structural constant A of the alloy is 0.03. The compressive creep deformation of Sn-9Zn are caused by the combined action of dislocation gliding and climbing,the rate of steady creep is dominated by dislocation climbing which is controlled by dislocation pipe diffusion process.
出处
《铸造技术》
CAS
北大核心
2007年第11期1506-1509,共4页
Foundry Technology
关键词
Sn-9Zn合金
无铅钎料
压蠕变
应力指数
激活能
Sn-9Zn alloy
Lead-free solder
Compressive creep
Stress exponent
Activation energy
