摘要
由于芯片规模的快速增长,给测试技术带来了新的挑战。结合系统芯片SoC测试结构的描述,对其核心部分测试外壳Wrapper和测试访问机制TAM做了论述,介绍了几类典型的测试访问机制TAM,分析其特点。同时对SoC的测试规划问题进行了讨论,指出了目前SoC测试面临的问题。
The test technology is facing the new challenge,which brought by the rapid increasing of the chips scales. The article de picts the test structure of SoC,and states the key components - test wrapper and test access mechanism（TAM ）, and introduces the popular and typical TAM ,analyzes their characteristics. Meanwhile, the article discusses the issue about SoC＇s test schedule,and points out the currently development conditions and presents problems in the field of SoC＇s test.
出处
《现代电子技术》
2007年第22期43-45,共3页
Modern Electronics Technique
