摘要
采用复合电镀方法,在镀镍液中加入粒径为5～10μm的铜微粒(晶粒粒径为52 nm)制备Ni-Cu复合镀层,探讨阴极电流密度、镀液的pH值与温度、搅拌速度、铜微粒含量和镍离子浓度对Ni-Cu复合镀层中铜微粒共析量的影响。结果表明,最佳镀液组成和工艺参数如下:七水合硫酸镍250～300 g/L,六水合氯化镍30～60 g/L,硼酸35～40 g/L,十二烷基硫酸钠0.05～0.1 g/L,pH值3.5～4.0,温度55～60℃,阴极电流密度2～3 A/dm2,搅拌速度为500～600 r/min,铜粉质量浓度8～9 g/L;镀层致密且铜微粒分布均匀;Ni-Cu复合镀层中铜的质量分数在5%～30%之间,其显微硬度HV0.2在450～750之间,且随镀层中铜含量的增大而增大,表现出高硬度的特点。
The Ni-Cu composite electrodeposition was prepared by composite electroplating when the Cu particles with 5-10 μm in size（the grain size is 52 nm） were put into the solution of Ni electroplating. The effects of cathode current density, pH value, temperature of solution, stirring rate, Cu particle content and concentration of Ni^2＋ on the content of Cu in Ni-Cu composite deposits were investigated to obtain tight Ni-Cu composite coating. The experimental results show that the optimal technological condition is as follows： NiSO4·7H2O, 250-300 g/L; NiCl2·6H2O, 30-60 g/L; H3BO3, 35-40 g/L; C12H25SO4Na, 0.05-0.10 g/L; pH value, 3.5-4.0; temperature, 55-60℃; cathode current density, 2-3 A/dm^2; stirring rate, 500-600 r/min; Cu content in solution, 8-9 g/L. The results of SEM and EDS analysis indicate that the Ni-Cu composite coating is dense and Cu particles in composite coating distribute uniformly; Cu content in the composite coating ranges from 5% to 30%. The microhardness （HV0.2） is between 450 and 750, increasing with the increase of Cu content in the composite coating. The composite coatings show the characteristic of high hardness.
出处
《中南大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2007年第3期474-479,共6页
Journal of Central South University:Science and Technology
关键词
铜
镍
复合电沉积
制备
copper
nickel
composite electrodeposition
preparation
