摘要
利用Gleeble 3500热模拟实验机,在800～1100℃、10～90min和6～20 MPa条件下对Ti_3SiC_2和Ni进行真空扩散连接。通过正交实验,研究了连接温度、连接压力和高温保温时间对试样连接强度的影响,优选出最佳工艺参数。结果表明,扩散连接工艺参数显著影响Ti_3SiC_2/Ni接头的剪切强度。在1000℃、10min和20MPa实验条件下,获得的Ti_3SiC_2/Ni接头的剪切强度达到(121±7)MPa,接近Ti_3SiC_2陶瓷的剪切强度。
Diffusion bonding of Ti3SiC2 and nickel has been conducted at temperatures of 800 - 1100 ℃ for 10 - 90 min under 6 - 20 MPa in vacuum. The effects of bonding temperature, bonding pressure and holding time were studied by orthogonal experiments. Joints strengths were determined through shear test. The results demonstrated that the maximum shear strength of （121±7） MPa, which is close to the shear strength of Ti3SiC2, has been obtained in the condition of 1000 ℃for 10 min under 20 MPa.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2007年第A02期461-464,共4页
Rare Metal Materials and Engineering
基金
国家自然科学基金项目(50371095
50232040
50302011)资助
中国科学院和法国原子能委员会合作项目
