摘要
采用ANSYS软件对YG8与TA 15真空扩散焊接头残余热应力进行三维瞬态有限元数值模拟,验证了Cu作为中间层材料在缓解YG8/TA15接头热应力方面的作用。在焊接温度为860℃与880℃,压力为5 MPa,扩散焊时间为60 min的条件下,进行YG8与TA15的真空扩散焊,分析了YG8与TA15连接界面的微观组织形貌。结果表明,YG8/Cu界面呈一条深色曲线,结合良好;而TA15/Cu界面生成呈层状分布的脆性Ti-Cu金属间化合物,将会影响到接头的整体性能,故对其在结合界面的体积与分布状态必须予以控制。
The 3D-transient-state FEM-simulation on residual stress in the joint of Titanium alloy （TA15）/ Hardmetal （YG8） was carried out using ANSYS software, it was indicated that the Cu interlayer played an important role in the relaxing the residual stress of the joint. The vacuum diffusion bonding was carried out between YG8 and TA15 at the 880℃ and 860℃ for 60 min under invariable axial pressure of 5 MPa, and the microstructure of the diffusion zone was analyzed. The results show that the interface of YG8/Cu takes on a bright line and bonds well, while the TA15/Cu interface presents brittle Ti-Cu intermetallic compound of layered distribution, which will affect the whole property of the joint. So the volume and distribution characteristics of the intermediates must be controlled in bonding process.
出处
《热加工工艺》
CSCD
北大核心
2007年第15期37-39,共3页
Hot Working Technology
关键词
真空扩散连接
硬质合金
钛合金
vacuum diffusion bonding
hardmetal
titanium alloys
