摘要
通过循环伏安法、交流阻抗法研究了一种有机络合剂对有机镀液中镁-镍合金在铜上共沉积的影响。并通过以合金镀层为电极的充放电性能测试,确定了镀液中络合剂的最佳浓度。结果表明,络合剂对电沉积是有利的,适量络合剂的加入能显著提高以镁-镍合金镀层为电极的最高放电比容量。
The influence of an organic complexing agent AD on electrodeposition of Mg-Ni alloy in organic bath on Cu electrode was studied by using cyclic voltammetry and AC impedance methods. The best concentration of this complexing agent in the plating solution was established by testing charge/discharge property of the deposit film. The results show that this complexing agent is useful for electrodeposition of Mg-Ni alloy. Proper addition of AD agent can significantly increase the maximum specific discharge capacity of the deposits.
出处
《电镀与精饰》
CAS
2007年第4期1-4,共4页
Plating & Finishing
基金
上海市教育委员会
上海市教育发展基金会"曙光计划"(99SG39)资助项目
关键词
有机络合剂
镁-镍合金
电沉积
储氢电极
organic complexing agent
Mg-Ni alloy
electrodepsition
hydrogen shorage electrode
