摘要
对碳化硅陶瓷注射喂料进行流变性能分析后得到合适的注射喂料.通过注射工艺和后续的脱脂-预烧结工艺成功制备出压渗用SiCp封装盒体的预成形坯.结果表明:SiCp装载量为65%,粘结剂成分为70%PW(石蜡)+29%HPDE(高密度聚乙烯)+1%SA(硬脂酸)的喂料在较宽的剪切速率和温度范围内均具有良好的注射性能;在合适的注射参数下可以制得完整无缺陷的注射坯;采用溶剂脱脂与热脱脂两步脱脂工艺,可以成功脱除注射坯体中的粘结剂,在1150℃进行预烧结,制备出了具有良好外观形貌、足够强度以及适中连通孔隙的预成形坯,可以满足后续加压渗铝制备SiCp/Al复合材料的封装盒体实验的要求.
Suitable feedstock was obtained after analyzing the rheological properties of silicon carbide ceramics. SiCp package box performs used in pressure infiltration experiment were manufactured through powder injection molding and debinding-pre-sintering process. Experimental results showed that the feedstork with 65 % SiCp load and 70 % PW （paraffin wax） ＋ 29 % HPDE （high-density polyethylene） ＋ 1% SA （stearic acid） had the best injection properties in the wide ranges of temperature and shear rate. The injection part with no defects could be manufactured at suitable injection parameters. The debinder was successfully removed from the injection part by solvent and thermal debinding process. SiCp package box preforms with good appearance, enough strength and proper porosity were obtained by pre-sintering process at 1 150 ℃, which was up to the request of following pressure infiltration experiment to fabricate SiCp/Al composites package boxes.
出处
《北京科技大学学报》
EI
CAS
CSCD
北大核心
2007年第5期470-474,共5页
Journal of University of Science and Technology Beijing
基金
国家自然科学基金资助项目(No.50274014)
民口配套研制项目(No.28300007)
关键词
电子封装材料
碳化硅(SiC)
喂料
注射成形
脱脂
electronic packaging materials
silicon carbide
feedstork
powder injection molding
debind
