摘要
厚膜导体Ｐｄ－Ａｇ／Ａｕ、Ｐｔ－Ｐｄ－Ａｕ／Ａｕ平面复合结构，Ｐｄ－Ａｇ／Ａｕ立体复合结构可使多种组装技术相互兼容。立体复合结构还可有效地降低导体线电阻，减少线损耗。而且。
A definition of thick film conductor's composite structure is given. Thick film conductor Pd Ag/Au and Pt Pd Au/Au planar composite structure and Pd Ag/Au stereo one make many assembling technology compatible each other. The stereo composite structure may yet effectively reduce conductor's line resistance and line dissipation. It's ultrasonic bonding capability is better.
出处
《电子元件与材料》
CAS
CSCD
1997年第1期36-40,共5页
Electronic Components And Materials
关键词
厚膜电路
导体
复合结构
组装技术
thick film circuit, conductor, composite structure
