摘要
当今电子、通信产品日新月异，要求电路板高密度组装，安装方式由表面安装（ＳＭＴ）取代通孔插装（ＴＨＴ）已是历史的必然，因此，印制板技术正向高密度、多层化方向飞速发展。文中介绍电子元器件和装配方法演变，电路板安装方式种类，表面安装用印制板的特点，实现印制板高密度、多层化的方法，印制板安装密度的选择、评估。
Nowadays,high-density and multi-layer PWB technology are developing faster and faster in order to meet the need of rapid progress of electronic and communication products So it has become a must to substitute SMT for THT This paper mainly introduces the development of electronic devices and assembly modes,characteristics of PWB using SMT,ways of realizing high-density & multi-layer PWB,assessment and determination of assembly density, as well as main points considered to select PWB processing factory and usual norms of process
出处
《电子工艺技术》
1997年第2期45-49,共5页
Electronics Process Technology
关键词
印制板
高密度
多层化
通孔插装
表面安装
PWB High-density Multi-layer THT Assembly density Processing factory
