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三相逆变电源的集成PEBB模块化设计 被引量:3

Modular Design of Three-phase Inverter Power Supply
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摘要 以250kVA 三相逆变电源装置为例,采用 DSP 全数字控制,从软件和硬件两个方面介绍了模块化的设计方案,初步进行了电力电子集成技术的研究。 Taking three-phase inverter power supply as example, and adopting DSP all-digital control, this article introduces the modular design scheme from two aspects and preliminarily studies the power electronic integrated technology.
出处 《电气自动化》 北大核心 2007年第2期16-18,共3页 Electrical Automation
关键词 集成技术 模块化 PEBB integrated technology modular design PEBB
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参考文献6

  • 1王兆安,杨旭,王晓宝.电力电子集成技术的现状及发展方向[J].电力电子技术,2003,37(5):90-94. 被引量:41
  • 2Power Electronic Building Blocks-a Systematic Approach to Power Electronics, Terry Ericsen, Program Officer, IEL 被引量:1
  • 3Romeo Letor, Static and Dynamic Behavior of Paralleled IGBT's,IEEE Transactions on Industry Applications, 1992(2):395-402 被引量:1
  • 4Ch. Keller, Y. Tadms, Are paralleled Igbt modules or paralleled IGBT inverters the better choice?, 1993 the European Power Electronics Association: 1-6 被引量:1
  • 5EUPECIGBT应用技术指南 被引量:1
  • 6王潞钢等编著..DSP C 2000程序员高手进阶[M].北京:机械工业出版社,2005:207.

二级参考文献7

  • 1Lee F C, Peng D M. Power Electronics Building Block and System Integration[A]. IPEMC'2000, The Third International [ C ]. 2000, 1 : 1 -- 8. 被引量:1
  • 2Van Wyk J D, Lee F C. Power Electronics Technology at the Down of the new Millennium--Status and Future[A]. PESC' 99.30th Annual IEEE[C]. 1999, 1:2--3. 被引量:1
  • 3Kornegay K T. Design Issues in Power Electronic Building Block (PEBB) System Integration [ A]. VLSI' 98,System Level Design, Proceedings, IEEE Computer Society Workshop[C]. 1998, 1:48--52. 被引量:1
  • 4Ericsen T. Power Electronic Building Bloek---a Systematic Approach to Power Electronics [ A]. Power Engineering Society Summer Meeting, 2000' IEEE[C]. 2000, 2:1216--1218. 被引量:1
  • 5Porter E, Ang S, Burgers K, et al. Miniaturizing Power Electronics using Multi-chip Module Technology [ A ].Proceedings of International Conference on Multichip Modules[ C ]. 1997, 1 : 329-- 333. 被引量:1
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  • 7Fisher R, FiUion R, Burgess J, et al. High Frequency,Low Cost, Power Packaging Using Thin Film Power Overlay Technology [ A]. APEC' 95 [ C]. 1995, 1 : 12-17. 被引量:1

共引文献40

同被引文献35

引证文献3

二级引证文献6

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