摘要
使用自主研制的新型高光束质量大功率半导体激光器对U74钢轨进行相变硬化，并对硬化结果进行分析。分析结果表明，经过半导体激光处理后的表面区域晶粒结构明显细化，硬化层硬度HV10/20可以达到800～900，比基体硬度提高3～4倍，沿半导体激光器光斑的不同轴向扫描对硬化层有很大影响，沿慢轴方向扫描得到的硬化层深度要远高于快轴方向的硬化层深度，硬度沿深度方向在过渡区附近迅速下降至基体硬度。实验表明，慢轴方向的相变硬化效率约为快轴方向的4倍。
A new kind of high power diode laser was developed in surface hardening on U74 rail steel. The results show that the grain of the rail steel is refined, and that the hardness HV10/20 of the harden layer increases to 800 - 900, which is 3 to 4 times higher than that of the base steel. There is different between feed direction along fast beam axis and slow beam axis. The harden layer is deeper when scan along slow beam direction, as well as the hardness fall down rapidly within the transition zone. The efficiency of surface hardening along slow axis is 4 times than that along fast axis.
出处
《铁道科学与工程学报》
CAS
CSCD
北大核心
2007年第1期63-67,共5页
Journal of Railway Science and Engineering
基金
科技部国际合作项目(2002AADF3101)
国家自然科学基金资助项目(60407009)
北京市自然科学基金资助项目(4042007)
