摘要
通过化学沉积法制备Fe-B化学镀层,用电化学方法分析了偶接铝、镀液组分和沉积工艺对Fe-B化学沉积行为的影响.结果表明,偶接铝使体系的沉积电位负移,降低了Fe-B合金化学沉积的极化阻力,特别是金属离子还原的极化阻力,从而诱导Fe-B的化学沉积.镀层的沉积速率依赖于镀液组分和沉积工艺.
Fe-B films were prepared by electroless deposition on brass substrate coupled with aluminum from the sulphate bath. The deposition behavior of Fe-B film was investigated by electrochemical and gravimetrical measurements. The results showed that the coupled aluminum shifted the deposition potential negatively and decreased the polarization resistance of reaction, especially that of the reduction reaction. The plating rate depended on the bath component and process parameters.
出处
《湖南大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2007年第1期52-55,共4页
Journal of Hunan University:Natural Sciences
基金
湖南省自然科学基金资助项目(05JJ30089)
