摘要
介绍了一种采用铜-聚酰亚胺薄膜多层基板的多芯片组件(MCM),它解决了高频下维持较低交调噪声带来的传输损耗增大,以及大量LSI芯片的同时切换噪声增大的问题。
This paper describes a multichip module having a copper-polyimide thin-film multiplayer substrate. This new substrate overcomes the problems of increased transmission loss at high frequencies while maintaining low crosstalk noise and the increased simultaneous switching noise with the large number of LSI chips
出处
《电子产品可靠性与环境试验》
2007年第1期42-45,共4页
Electronic Product Reliability and Environmental Testing
关键词
多芯片组件
交调噪声
同时切换噪声
multichip module （MCM）
crosstalk noise
simultaneous switching noise
