期刊文献+

水分在粘接接头界面的扩散系数和动力学

The measurement of water diffusion coefficient and dynamics in adhesive/c-c composites joints
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摘要 为研究水分在粘接接头界面的扩散行为,采用X射线能谱(EDX)分析方法计算了水分在碳/碳复合材料粘接接头界面的扩散系数和扩散动力学,并比较了水分在不同表面处理方法处理的碳/碳复合材料粘接接头界面的扩散系数和扩散动力学.结果表明,经偶联剂处理的碳/碳复合材料耐久性能要好于化学氧化和砂纸打磨处理,这与剪切强度测试结果相一致. EDX analysis method was used to measure the width of adhesive/c - c composites joints interface and its elements content, so the water diffusion coefficient and dynamics in adhesive/c - c composites joints can be calculated. Water diffusion coefficient and dynamics of adhesive/c - c composites joints treated by different surface treatment methods were also researched in this paper. Results indicated that the water diffusion speed in adhesive/c - c composites joints treated by sand paper was faster than that treated by chemical oxidation and by silane couple agent treatment.
出处 《材料科学与工艺》 EI CAS CSCD 北大核心 2006年第6期601-604,共4页 Materials Science and Technology
关键词 扩散系数 动力学 碳/碳复合材料粘接接头界面 diffusion coefficient dynamics adhesive/c - c composites joints
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参考文献8

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