摘要
使用有限元法模拟计算了Cu箔、Mo箔对缓解Ti(C,N)/40Cr钎焊接头残余应力的效果。结果表明,无缓冲层直接钎焊,在Ti(C,N)金属陶瓷外侧靠近钎缝的狭小区域内产生较高的拉伸残余应力,其峰值达到268 MPa;使用屈服极限低的Cu箔,接头最大残余拉应力下降到98 MPa,缓解应力效果显著,但最大残余拉应力所处区域与无缓冲层相比没有明显变化;使用线膨胀系数小的Mo箔,应力峰值出现在Mo箔中,同时缓解应力效果不如Cu箔;无论使用Cu箔还是Mo箔,最佳厚度约为0.8 mm左右,大于或小于该厚度值,应力得不到有效释放。
To obtain the effect of copper and molybdenum interlayer on the residual stress of Ti(C,N)/40Cr brazed joint,the finite element mothod was conducted.The simulation results showed that the high tensile stress concentration with a maximum stress magnitude of 268 MPa happens at the narrow zone near ceramic/steel seam in the ceramic side without interlayer,but when the metal with copper foil of low yield stress was used as interlayer,the residual stress can be significantly decreased,and the maximum residual tensile stress reduce to 98 MPa,and there are to change of maximum genetic zone in brazed joint with interlyer and with out interlayer.When the low linear expansion coefficient metal molybdenum was used,the maximum stress occurred at the molybdenum interlayer zone,which gave a less residual stress reduction effect than copper foil.It also can be seen that the optimum interlayer thickness is about 0.8 mm for either interlayer kinds,and the thickness with thicker or thinner than 0.8 mm will be harmful to stress reduction efect.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2006年第12期65-68,共4页
Transactions of The China Welding Institution
基金
江苏省教育厅自然科学基金资助项目(05KJB460029)
