摘要
以丙烯酸酯化环氧树脂E-51,合成了光固化快速成型的关键材料——光敏树脂。探讨了酯化反应及光聚合机理,用SEM和IR表征了树脂体系的固化结构和固化度。结果表明,酯化反应是环氧基开环、C=C引入的反应;光聚合的机理是C=C裂解、C-C链增长的反应;树脂体系固化后呈不规则体型交联结构;限定其它条件,光引发剂含量为3.5%时,固化度最好。
In this paper a photosensitive resin the key material for the ultraviolet curing based on acrylic acid esterified epoxy resin E-51 is synthesized. The mechanism of esterification and photopolymerization are discussed, curing structure and photopolymerisable degree of the architecture are characterized by SEM and IR, respectively. The results, show that the esterification of epoxy resin is that epoxy matrix breaks and C=C is introduced. The mechanism of photopolymerisable reaction is that C=C degrades and C-C extends. The pattern of film is irregular crosslinked form construction. Fixing other conditions, the UV-curing degree is optimal when photo-initiator content is 3. 5%.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2006年第12期132-133,143,共3页
Materials Reports
基金
教育部高校博士学科点专项科研基金(20050204JJ)
山西省自然科学基金(20051028)
太原市大学生科技创新项目(20060201JJ)
太原市科技风险投资项目(2005019)
关键词
紫外光固化
光聚合
SEM
红外光谱
ultraviolet curing, photopolymerization, SEM, IR spectrum
