摘要
随着集成电路封装技术的发展,倒装芯片技术得到广泛的应用。由于材料的热膨胀失配,使倒装焊点成为芯片封装中失效率最高的部位,而利用快捷又极具参考价值的有限元模拟法是研究焊点可靠性的重要手段之一。介绍了集成电路芯片焊点可靠性分析的有限元模拟法,概括了利用该方法对芯片焊点进行可靠性评价常见的材料性质和疲劳寿命预测模型。
With the development of IC packaging technology, flip chip is widely used. Because of the coefficent of thermal expansion mismatch of materials, the flip chip solder joint become the site with highest failure rate. The finite element simulation is one of quick, valuable and important techniques for reliability study of solder joints. In this paper, the finite element simulation for reliability analysis of IC solder joints is introduced. Common material behavior and fatigue models in solder joint life prediction using the proposed method are discussed.
出处
《电子产品可靠性与环境试验》
2006年第5期60-63,共4页
Electronic Product Reliability and Environmental Testing
关键词
倒装芯片
焊点可靠性
有限元
热循环
应力
应变
疲劳寿命模型
flip chip
solder joint reliability
finite element
thermal cycling
stress/strain
fatigue life model
