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电沉积法制备锂离子电池锡铜合金负极及表面修饰 被引量:1

Synthesis and Surface Modification of Tin-Copper Alloy Anode for Lithium Ion Battery by Electrodeposition Process
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摘要 采用脉冲电沉积与热处理相结合的工艺制备铜锡合金,并作为锂离子电池的负极考察其电化学性能。在集流体铜箔上直接沉积锡,然后进行热处理形成铜锡合金层。锡电极在200℃和300℃热处理过程中分别形成了Sn/Cu6Sn5/Cu3Sn和Sn/Cu3Sn复相结构,合金相的产生提高了电极的循环性能,但降低了电极的比容量。通过在锡电极表面覆铜,改变了锡电极热处理后的表面成分,由Sn/Cu6Sn5混合相转变为Cu/Cu6Sn5混合相,有效提高了锡电极长期循环的结构稳定性,使电极同时具备了较高的活性和较好的循环性能。 A pulsed electrodeposition and heat-treatment process was used to prepare copper-tin alloys for the anode of lithium ion battery. The copper-tin alloy electrodes with the structures of Sn/Cu6Sn5/Cu3Sn and Sn/Cu3Sn were obtained by plating tin on a substrate of copper foil followed by an anneal-treatment process at 200℃ and 300℃. The surface modification of copper-tin alloy electrode was tried. The improved cycle performances and the relatively low specific capacity are due to the formation of copper-tin alloy phases. The main component of the electrode surface changed from Sn/Cu6Sn5 to Cu/Cu6Sn5 after copper coating followed by heat-treatment. After surface modification, the copper-tin alloy electrode presented a high structure stability in a long cycle term. As a result, the copper-tin alloy anode was obtained with high activity and high stability.
机构地区 清华大学
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2006年第A02期359-364,共6页 Rare Metal Materials and Engineering
关键词 锂离子电池 锡铜合金 热处理 表面修饰 lithium ion battery tin-copper alloy heat treatment surface modification
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  • 1李阳兴,万春荣,姜长印,朱永.以β-Co(OH)_2为前驱体的锂离子电池正极材料LiCoO_2[J].清华大学学报(自然科学版),1999,39(12):44-46. 被引量:10
  • 2Endo M, Kim C, Nishimura K et al. Carbon[J], 2000, 38(2):183 被引量:1
  • 3Younglae Kim, Heonyoung Lee, Serkwon Jang et al. Solid State lonics[J], 2003, 160(3-4): 235 被引量:1
  • 4Wolfenstine J, Campos S, Foster D et al. JPower Sources[J],2002, 109(1): 230 被引量:1
  • 5Noriyuki Tamura, Ryuji Ohshita, Masahisa Fujimoto et al. J Power Sources[J], 2002, 107(1): 48 被引量:1
  • 6Thackeray M M, Vaughey J T, Johnson C Set al. J Power Sources[J], 2003, 113(1): 124 被引量:1
  • 7Hitohiko Honda, Hiroki Sakaguchi, Ichiro Tanaka et al. J Power Sources[J], 2003, 123(2): 216 被引量:1
  • 8Jingtian Yin, Masashi Wada, Shigeo Tanase et al. J Electrochemical Society[J], 2004, 151 (4): A583 被引量:1
  • 9Zhang Y, Fu Z W, Qin Q z. Electrochemistry Communications[J], 2004, 6(5): 484 被引量:1
  • 10Dong Q F, Wub C Z, Jin M Get al. SolidState Ionics[J], 2004,167(1-2): 49 被引量:1

二级参考文献9

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  • 1SURME Y, GURTEN A A, BAYOL E, et al. Systematic corrosion investigation of various Cu-Sn alloys electrodeposited on mild steel in acidic solution: Dependence of alloy composition [J]. Journal of Alloys and Compounds, 2009, 485 (1/2): 98-103. 被引量:1
  • 2VOLOV I, SUN X X, GADIKOTA G, et al. Electrodeposition of copper-tin film alloys for interconnect applications [J]. Electrochimica Acta, 2013, 89: 792-797. 被引量:1
  • 3PADHI D, GANDIKOTA S, NGUYEN H B, et al. Electrodeposition of copper-tin alloy thin films for microelectronic applications [J]. Electrochimica Acta, 2003, 48 (8): 935-943. 被引量:1
  • 4SUBRAMANIAN B, MOHAN S, JAYAKR/SHNAN S. Structural, microstructural and corrosion properties of brush plated copper-tin alloy coatings [J]. Surface and Coatings Technology, 2006, 201 (3/4): 1145-1151. 被引量:1
  • 5洛温海姆.现代电镀[M].3版.北京航空一O三教研室,译.北京:机械工业出版社,1982:588-589. 被引量:1
  • 6VOROBYOVA T N, BOBROVSKAYA V P, SVIRIDOV V V. The composition and structure of electrodeposited copper-tin alloy films [J]. Metal Finishing, 1997, 95 (11): 14, 16-18, 20. 被引量:1
  • 7SCHLESlNGERM,PAUNOVICM,现代电镀[M].4版.范宏义,译.北京:化学工业出版社,2006:29-30. 被引量:1
  • 8ZANELLA C, XING S J, DEFLORIAN F. Effect of electrodeposition parameters on chemical and morphological characteristics of Cu-Sn coatings from a methanesulfonic acid electrolyte [J]. Surface and Coatings Technology, 2013, 236: 394-399. 被引量:1
  • 9BARBANO E P, DE OLIVEIRA G M, DE CARVALHO M F, et al. Copper-tin electrodeposition from an acid solution containing EDTA added [J]. Surface and Coatings Technology, 2014, 240: 14-22. 被引量:1
  • 10张琪,曾振欧,徐金来,赵国鹏.低锡铜–锡合金无氰电镀工艺[J].电镀与涂饰,2011,30(9):1-4. 被引量:14

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